Machine PCB Placement

Our most significant activity in present is made-to-order PCB placement, mostly machine, supporting SMT technology. Our technological center is equipped adequately to this fact.

There is a short presentation of our production procedures and used technology.

Serigraphing

First action is a board serigraphing. We use two serigraphs, Uniprint Go and newer, semiautomatic SP150. Both contain the same frames, therefore the technical parameters of a template identical.

Placement

We dispose of two automatic placement machines, usually using the newer one, CLM9000 V PLUS, which can place up to 3000 SMD devices per hour. It can operate with devices in different precise cases, such as 0402, QFP with 0.5 mm pitch (even 0.3 mm using camera) or BGA with 0.45 mm pitch.

Post Placement, Corrections

To place exacting parts as BGA we use hand manipulator Essemtec. The same is used for corrections and repairs. A useful feature is integrated infraheater and underlying camera.

Soldering

In the next step boards need to be soldered. That can be accomplished in infratunnel or, usually, in SLC 300 - vapour phase soldering machine. It is also possible to use solder wave.