As the electronic systems integration degree grows, the demands on the production technology get higher and higher. Pitch reduction and circuits encapsulation in QFN and BGA packagings almost excludes usage of one- or two-layer printed circuit boards and production at semiprofessional workplaces. But even fully professional products get considerably more expensive if a simple board needs to be controlled by an MCU in BGA packaging requiring multilayer circuit board in the 7th and higher class of precision.
The solution is a use of modules integrating all components requiring high precision, leaving the motherboard as simple as possible. And that is the reason for us to proudly present a first of our SQM® modules serie product SQM4-K70. There follow the common features of the serie products:
Control module with processor Kinetis K70 with 1 MB on-chip memory, 128 MB DDR2 SDRAM memory, 256 MB FLASH memory, Ethernet, USB and a wide range of other peripheries connectable via 135 GPIO. All this compressed on 16 cm2 only.More information
SOM with heterogeneous dual-core processor Vybrid VF6 with 1 MB on-chip memory, 512 kB L2 Cache, DDR3 memory 128 MB, Flash memory 256 MB, 2x Ethernet, 2x USB and a wide range of other peripherals connectable via 135 GPIO. All this compressed on 16 cm2 only.More information
System-on-module with dual core microprocessor ZYNQ XC7Z020 from the SQM® modules serie. Besides the ARM Cortex A9 dual core microprocessor with 256kB of on chip dual port SRAM memory (OCM) accessible from PS and PL, it disposes of a 1 GB DDR3 SDRAM memory, 16 MB QSPI NOR FLASH memory, GBit and Fast Ethernet, USB and a wide range of other peripherals connectable via up to 141 GPIO. Quick and easy development is ensured by a JTAG connector. All this compressed on 16 cm2 only.More information
Development board expanding the most of peripheries of the SQM4-K70 module presents the advanteges of SQM4 modules serie in practice. And yes, it really is just a simple two-layer board!More information